BiTS Call For Presentations
Deadline
Extended!
2009 Expo Registration
2009 Sponsorship and Advertising |
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BiTS
is the world’s premier workshop dedicated to
providing a forum for the latest information
about burn-in and test socketing, and related
fields. Last year's workshop brought together
over 500 participants, representing more than
100 companies from around the world, and more
than 50 exhibitors. These participants included
end users and suppliers of sockets, boards,
burn-in systems, handlers, packages and other
related equipment, materials and services. |
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For an electronic copy of this call for papers in
Adobe(R) Acrobat(R) (.pdf) format, the following file can be downloaded:
bits2009cfp.pdf
Click here if you need the latest Acrobat(R) reader
from Adobe(R):
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CALL FOR
PRESENTATIONS
The 2009 BITS Workshop is seeking presentation and poster proposals on a broad
range of topics. |
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ABSTRACT
SUBMISSION |
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Become an author and you'll
contribute to a stimulating and comprehensive program by sharing
your latest work and advancements with colleagues from around
the globe. |
Don’t wait. Submit
a 250 to 500 word abstract of your original, previously
unpublished, technical presentation by October 17, 2008
November 1, 2008. to
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Include with your emailed
submission:
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TITLE OF PRESENTATION
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EACH AUTHOR’S name, affiliation,
postal and email addresses, telephone number(s). Identify
who the presenter will be.
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| For further information, questions or comments, please
contact the BiTS Office at:
or by phone at 845-226-7560.
Abstract reviews /selections will be completed, and authors
notified, on or about NOVEMBER 16, 2008. |
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Some topic ideas
include Techniques and Technologies that address |
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MECHANICAL & ELECTRICAL CHALLENGES |
- Packaging Trends - Wafer Level Packages,
Thinner Packages & PoP
- Design and characterization of contacting
technologies and materials
- Thermal management and modeling Future
(including ‘green’) packaging trends and new technologies
- Design tools: GD&T; FEA, etc.
- Ball deformation & package stress
- Package alignment
- High frequency; high data rate; high current
techniques and technologies
- Handler & change kit designs and
considerations
- Managing ESD
- Socketing for Analog and other non-digital
devices
- Fine Pitch Kelvin Contacting
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OPERATIONAL CHALLENGES |
- Test & Burn-in floor operations
- Socket repair and cleaning methods
- Value Engineering: methods and techniques for
reducing cost of ownership, achieving low-cost burn-in, etc.
- Massively parallel test
- Test strategies for shorter consumer product
cycles
- Strip Testing
- Wafer Level Testing
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PCB
DESIGN & MANUFACTURING CHALLENGES |
- For high temperature Burn-in board
applications
- High data rate test applications
- Ultra-fine pitch
- CTE, force & planarity issues
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