BiTS
2012 Call For Presentations
2012 Expo Registration
2012 Sponsorship and Advertising
2012 Attendee Registration Opens December 2011
Hotel Information |
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BiTS is the world's premier workshop dedicated
to providing a forum for the latest information
about burn-in and test tooling, and related
fields. At BiTS you'll find a comprehensive
technical program, exhibits of the latest
products and services, and many opportunities to
meet, network and explore ideas with other test
and burn-in strategies professionals. |
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For an electronic copy of this call for papers in
Adobe(R) Acrobat(R) (.pdf) format, the following file can be downloaded:
bits2012cfp.pdf
Click here if you need the latest Acrobat(R) reader
from Adobe(R):
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March 4-7, 2012
Mesa
Arizona
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CALL FOR
PRESENTATIONS
The 2012 BITS Workshop is seeking presentation and poster proposals on a broad
range of topics.
DEADLINE
EXTENDED TO NOVEMBER 1,
2011 |
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ABSTRACT
SUBMISSION |
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Become a BiTS author! Contribute to a
stimulating and comprehensive program by sharing your latest work
and advancements with colleagues from around the globe. |
Don’t wait. Submit
a 250 to 500 word abstract of your original, previously
unpublished, technical presentation by October 14, 2011
November 1, 2011 to
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Include with your emailed
submission:
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TITLE OF PRESENTATION
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EACH AUTHOR’S name, affiliation,
postal and email addresses, telephone number(s). Identify
who the presenter will be.
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For further information, questions or comments, please
contact the BiTS Office at:
or by phone
at 845-226-7560.
Abstract reviews /selections will be completed, and authors
notified, on or about NOVEMBER 15, 2011. |
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Some topic ideas
include Techniques and Technologies that address: |
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ELECTRICAL & MECHANICAL
CHALLENGES |
- WLCSP Test for KGD or Final Test
- Wafer Level Packages, Thinner Packages & PoP
- Design tools: GD&T; FEA, etc.
- Ball deformation & package stress
- Package alignment
- High frequency; high data rate; high current
techniques and technologies
- Handler & change kit designs and considerations
- Managing ESD
- Fine Pitch Kelvin Contacting
- Automotive semiconductor requirements
- Thermal management and modeling
- Contact technology: dissimilar metal
interface degradation, carbon nanotube developments, non-traditional
interface materials, contact reliability in test and burn-in
conditions
- Socket and contactor contact
cleaning methods
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PCB DESIGN AND MANUFACTURING CHALLENGES |
- For high temperature Burn-in board applications
- High data rate test applications
- Space Transformers
- Ultra-fine pitch
- Board to Board Interconnects
- CTE, force & planarity issues
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ADVANCED
PACKAGING
TECHNOLOGIES |
- Minimizing metals & plating of material
- Low power and/or alternative power
- Lead-Free
- Reducing/recycling materials used in shipping
sockets, PCBs and other products
- Interconnect solutions for photovoltaic products
- Cradle to cradle manufacturing
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TEST PROCESS &
OPERATIONAL CHALLENGES |
- Test & Burn-in floor operations
- Socket repair and cleaning methods
- Value Engineering: methods and techniques for reducing cost of
ownership, achieving low-cost burn-in, etc.
- Massively parallel test
- Test strategies for shorter consumer product cycles
- Socket & PCB
checkout & qualification
- Strip Testing
- Test-in-Tray
- Wafer Level Testing
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