Please join us for the 4th annual BiTS events in China!

半导体芯片“老化及性能测试技术研讨会”Burn-in and Test Strategies (BiTS) China Workshop即将拉开帷幕! 我们很荣幸地宣布2018年的BiTS研讨会更名为TestConX中国,并将在苏州、深圳举办两场研讨会, 旨在为业内精英提供信息交流平台,期盼各位就与行业相关的主题展开广泛且深入的讨论。

2018年10月23日(周二)苏州,中国
October 23, 2018 (Tuesday) - Suzhou, China

2018年10月25日(周四)深圳,中国
October 25, 2018 (Thursday) - Shenzhen, China

Interested in exhibiting at the TestConX China EXPO or sponsoring TestConX China? Please download the propspectus and contact us today! (Limited availability)

To stay informed on the program please sign up for our mailing list.

Contact us at [javascript protected email address]

For assistance in Mandarin please contact / 如需中文接洽,敬请联系:
郭晶 / Misu Guo
[javascript protected email address]
Phone: +86 189-1896-7485

TestConX 2019
March 3 - 6, 2019

Save the date and join us in Mesa, Arizona for the 20th anniversary event!

Call for Presentations and Posters is now open! Submit early by October 1st for "early bird" prize.

BiTS 2018
Thank you!

Many thanks to the attendees and exhibitors who made BiTS 2018 a success! Our nineteenth annual event brought together over four hundred fifty participants to learn what is Now & Next in test and burn-in.

It was a very full program of presentations with everything from high-frequency test to burn-in to socket technology to test cell integration. And much more!

The presentations and multi-media recordings (audio recordings synchronized with the slides) are available in the 2018 Premium Archive now.

Looking to follow up with a BiTS EXPO exhibitor? Please see the BiTS EXPO directory.

TestConX China 2018 Sponsors
Shenzhen Premier Sponsor
Honored Sponsors

TestConX 2019
Sponsors
Premier Sponsor